Direct Bury Metal Free (DBmf)
Thick Wall Microduct Tube Bundle
DBmf Thick Wall bundles use high‑performance microducts with ultra‑low friction inner surfaces, encased in a robust, thin outer sheath that delivers exceptional mechanical durability in direct‑buried applications. The construction is optimised for installation by microtrenching, mole plough or open trench methods, providing a reliable, future‑proof pathway for blown fibre without needing extra protective closures at branch‑off points or inline connections.
Data Center
FTTH
Telecom
Key Benefits
1. Direct burial
durability reduces civil costs by eliminating separate ducts and extra protection in typical ground conditions.
2. Low‑friction
iner cuts installation time and effort, enabling long, continuous fibre runs.
3. Blowing track
performance confirmed up to 2000 m, supporting efficient network build‑out over long distances.
4. Pressure‑tight
up to 15 bar, supporting demanding blowing operations and later maintenance interventions.
5. UV resistance
for up to 2 years in EU conditions allows temporary above‑ground exposure during logistics and installation.
Features
- Extremely tough, thick‑wall microducts engineered for direct burial in prepared ground.
- High crush resistance removes the need for additional protective closures at branch‑offs and inline joints in many designs.
- Ultra‑low friction EM‑Liner internal surface in each microduct for efficient fibre blowing.
- Metal‑free construction, avoiding any aluminium or metallic layers in the bundle.
- Wide range of standard OD/ID and way configurations from 5/2.1 mm up to 16/12 mm and 1–24 way, depending on size.
Certifications/compliance information
- Microducts tested in accordance with IEC 60794‑5 standards for outside plant fibre products.
- Performance characteristics such as blowing distance, pressure rating, UV stability and crush resistance are validated through Emtelle test programmes aligned with industry practice for direct‑buried microduct systems.
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